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Prime Minister of Thailand: The third phase of relief funds will be distributed next year.Market News: NVIDIA has increased its recruitment in China, focusing on artificial intelligence to drive cars.Increase to 6 flights per week. The Shanghai-Riyadh route of China Eastern Airlines will be encrypted soon. It was learned from China Eastern Airlines on December 12 that recently, China Eastern Airlines announced that it will encrypt the direct flight route from Shanghai to Riyadh from 3 flights per week to 6 flights per week from February 21, 2025.

Iflytek and other robot technology companies have a registered capital of 30 million yuan. According to Tianyancha App, Anhui Lingdong General Robot Technology Co., Ltd. was recently established with Hu Guoping as the legal representative and a registered capital of 30 million yuan. Its business scope includes industrial robot manufacturing, industrial robot sales, intelligent robot research and development, electrical equipment sales, computer software and hardware and auxiliary equipment retail, information system integration services, intelligent robot sales, mechanical equipment leasing, etc. According to shareholder information, the company is jointly held by Anhui Xunfei Yunchuang Technology Co., Ltd., a subsidiary of Iflytek (002230), Anhui Yanzhi Technology Co., Ltd. and Anhui Lingji Wanwu Technology Partnership (Limited Partnership).The dividend index has performed better for a long time, and the allocation value of Standard & Poor's dividend ETF(562060) has attracted much attention. By midday on December 12, the standard & poor's dividend ETF(562060) had increased by 0.44%, with a turnover of 10.1606 million yuan. The constituent stocks are mixed. In terms of rising, Yongxing Materials led the gains, and Voice Holdings followed suit. In terms of decline, Luan Huan was able to lead the decline, while Orchid Science and Technology fell. In the news, as of December 11, 940 listed companies have thrown out 994 single and medium-term cash dividend plans this year, with a year-on-year increase of 269.41%; The total amount of dividends involved was 667.519 billion yuan, a year-on-year increase of 166.24%. According to the analysis of Xingzheng Securities, the long-term performance of dividend strategy in the US stock market is significantly better than that of the S&P 500 index, and its stability is higher. From 2003 to 2022, the annualized rate of return of the S&P 500 high-quality and high-dividend index reached 12.0%, which was higher than the S&P 500 index's 10.5%. Donghai securities said that under the downward trend of risk-free interest rate, dividend stability and growth potential have become important considerations, and we are optimistic about the investment value of dividend plate.Hua Fu Securities completed the capital increase and share expansion of over 4.7 billion yuan, and the Shanghai United Assets and Equity Exchange issued a closing announcement: the capital increase and share expansion project of Hua Fu Securities was launched. There were 17 participants in this capital increase, including 4 original shareholder units and 13 new investors, with a total investment of about 4.757 billion yuan. According to China, a brokerage firm, Hua Fu Securities' capital increase and share expansion has attracted wide attention in the market, becoming the largest equity financing case in the securities industry this year.

By 11:30, 100 stocks in the two cities had daily limit.Another member of South Korea's ruling party said he would vote to impeach President Yoon.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)